Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods

A substrate, comprising:

• a first pair of electrical contacts on a first surface of the substrate and configured to receive a first capacitor in one of two perpendicular orientations, wherein the electrical contacts of the first pair have a first intra-pair spacing corresponding to a first distance between capacitor contacts of the first capacitor;
• and
• a second pair of electrical contacts on the first surface of the substrate and configured to receive a second capacitor in another of the two perpendicular orientations, wherein the electrical contacts of the second pair have a second intra-pair spacing corresponding to a second distance between capacitor contacts of the second capacitor,
• wherein the first pair of electrical contacts is configured to connect the first capacitor to both a first circuit branch of the substrate and to a second circuit branch of the substrate, and
• wherein the second pair of electrical contacts is configured to connect the second capacitor to both the first circuit branch of the substrate and to a third circuit branch of the substrate.

A substrate, comprising:

• a first pair of electrical contacts on a first surface of the substrate and configured to receive a first capacitor in a first orientation, wherein the electrical contacts of the first pair have a first intra-pair spacing corresponding to a first distance between capacitor contacts of the first capacitor;
• a second pair of electrical contacts on the first surface of the substrate and configured to receive a second capacitor in a second orientation different from the first orientation, wherein the electrical contacts of the second pair have a second intra-pair spacing corresponding to a second distance between capacitor contacts of the second capacitor,
• wherein the first pair of electrical contacts is configured to connect the first capacitor both to a first circuit branch of the substrate and to a second circuit branch of the substrate, and
• wherein the second pair of electrical contacts is configured to connect the second surface-mount capacitor both to a third circuit branch of the substrate and to a fourth circuit branch of the substrate.