Adhesive and thermal interface material on a plurality of dies covered by a lid

A package structure, comprising:

• an interposer;
• a first die and a second die disposed on the interposer;
• an underfill layer disposed between the first die and the second die, wherein a top surface of the underfill layer substantially levels with a first back-side of the first die and a second back-side of the second die;
• an adhesive pattern overlying the underfill layer between the first die and the second die;
• and
• a thermal interface material (TIM), having a bottom surface in direct contact with the first die, the second die and the adhesive pattern.

A package structure, comprising:

• an interposer;
• a first die and a second die disposed on the interposer;
• an underfill layer disposed between the first die and the second die;
• a multi-layered structure disposed on the first die, the second die and the underfill layer, wherein the multi-layered structure comprises:
• a pair of metal layers;
• a thermal interface material (TIM) disposed between the pair of the metal layers;
• and
• a lid adhered to a top metal layer among the pair of metal layers, wherein the lid covers the first die and the second die.