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US 11,894,285 B2Granted
Back plate assembly and electronic device
AssigneeTyco Electronics (Shanghai) Co., Ltd.
InventorsJiefeng Zhang, Zhiqiang Li, Biaobing Lv, Guoxiao Shen, Wei Zhao, Jinqiang Wang
Life of this patent
Estimating the term…
Abstract
A back plate assembly includes a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction. A pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove.
Claims5
An electronic device, comprising:
- a back plate assembly including a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction, a pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove and the arch plate having a length less than a length of the base plate when assembled into the groove;
- an electronic component including a circuit board having a bottom side placed directly on the arch plate;
- and
- a connection mechanism mounting the electronic component on the back plate assembly and applying a loading force on the electronic component directed in a vertical direction of the arch plate,
- wherein the electronic component includes a socket connector mounted on a top side of the circuit board directly opposite the arch plate, a central processing unit mounted on the socket connector, and a heatsink mounted on the central processing unit.
2 more elements
Dependencies are inferred from the claim text.