Vented lids for integrated circuit packages
AssigneeIntel Corporation
InventorsZhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy, Cheng Xu, Junnan Zhao, Ying Wang
Life of this patent
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Abstract
Disclosed herein are vented lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A vent may extend between the interior surface and the exterior surface of the lid, and the vent may at least partially overlap the die.
Claims20
An integrated circuit (IC) package, comprising:
- a package substrate;
- a die;
- and
- a lid including an interior surface and an exterior surface,
- wherein:
- the die is between the package substrate and the lid,
- the interior surface of the lid is between the die and the exterior surface of the lid,
- a plurality of vents extends between the interior surface and the exterior surface,
- a number of vents in the plurality of vents is more than ten,
- at least one vent in the plurality of vents at least partially overlaps the die,
- the interior surface of the lid includes a metal layer,
- the metal layer includes gold or silver, and
- the metal layer does not extend into the at least one vent.
A lid for an integrated circuit (IC) package, comprising:
- a top surface;
- a bottom surface parallel to the top surface;
- a side surface perpendicular to the top surface and the bottom surface;
- and
- a vent having a first end at the bottom surface and a second end at the side surface,
- wherein:
- the vent comprises a first plurality of openings at the first end and a second plurality of openings at the second end,
- the first plurality of openings is perpendicular to the top surface,
- the second plurality of openings is parallel to the top surface,
- the first plurality of openings is connected to the second plurality of openings between the top surface and the bottom surface,
- the bottom surface of the lid includes a metal layer,
- the metal layer includes gold or silver, and
- the metal layer does not extend into the vent.
An integrated circuit (IC) assembly, comprising:
- an IC package including a thermal interface material (TIM) between a die of the IC package and a lid of the IC package, wherein the lid of the IC package includes a plurality of vent openings in a bottom surface of the lid, a number of vent openings in the plurality of vent openings is more than ten and the TIM is at least partially between the vent openings and the die;
- and
- a circuit board coupled to the IC package,
- wherein:
- the TIM includes gold or silver, and
- the TIM does not extend into the vent openings.
Dependencies are inferred from the claim text.