Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorYoshiaki Takahashi
Life of this patent
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Abstract
Provided is a semiconductor module comprising a semiconductor chip, a lead frame including a chip connection portion configured to connect the lead frame to the semiconductor chip, and a bonding member configured to connect the chip connection portion and the semiconductor chip, wherein the semiconductor chip includes a semiconductor substrate, an active portion provided on the semiconductor substrate, and a transverse protective film provided above the active portion and provided to traverse the active portion in a top view, wherein the chip connection portion includes a center portion which covers a center of the transverse protective film in a top view and a first cut-out portion provided from a first end side of the chip connection portion towards the center portion.
Claims20
A semiconductor module comprising:
- a semiconductor chip;
- a lead frame including a chip connection portion configured to connect the lead frame to the semiconductor chip;
- and
- a bonding member configured to connect the chip connection portion and the semiconductor chip;
- wherein the semiconductor chip includes:
- a semiconductor substrate;
- an active portion provided on the semiconductor substrate;
- and
- a transverse protective film provided above the active portion and provided to traverse the active portion in a top view:
- wherein the chip connection portion includes:
- a center portion which covers a center of the transverse protective film in a top view;
- and
- a first cut-out portion provided from a first end side of the chip connection portion towards the center portion.
Dependencies are inferred from the claim text.