Semiconductor stress monitoring structure and semiconductor chip
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChien-Mao Chen
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Abstract
Present disclosure provides a semiconductor stress monitoring structure, including a substrate, first conductive segments over the substrate, second conductive segments and a sensing structure proximate to the substrate. The first conductive segments are arranged parallel to each other. The second conductive segments are arranged below the first conductive segments and parallel to each other. The first conductive segments and the second conductive segments extend in the same direction. The sensing structure is configured to respond to a stress caused by the first conductive segments and the second conductive segments and generate a monitoring signal.
Claims20
A semiconductor stress monitoring structure, comprising:
- a substrate;
- a plurality of first conductive segments over the substrate, arranged parallel to each other;
- a plurality of second conductive segments arranged below the plurality of first conductive segments and parallel to each other, wherein the plurality of first conductive segments and the plurality of second conductive segments extend in the same direction;
- and
- a sensing structure proximate to the substrate, configured to respond to a stress caused by the first conductive segments and the second conductive segments and generate a monitoring signal.
A semiconductor chip, comprising:
- a plurality of semiconductor stress sensing structures, each of the semiconductor sensing structure comprising:
- a stress enhancement structure over a metallization of the semiconductor chip;
- and
- a sensing structure under the metallization of the semiconductor chip, configured to generate a monitoring signal in response to a stress caused by the stress enhancement structure.
A semiconductor stress monitoring structure, comprising:
- a stress enhancement structure comprising a plurality of conductive segments arranged parallel to each other, wherein the plurality of conductive segments comprises ultra-thick copper metal line;
- and
- a sensing structure under a projection of the conductive segments, configured to generate a monitoring signal in response to a stress caused by the conductive segments.
Dependencies are inferred from the claim text.