Top via with damascene line and via

A top via, comprising:

• air etch stop layer on a fill layer;
• a conductive line in the fill layer;
• a trench plate on a conductive line;
• a gap between the etch stop layer and the trench plate;
• a conductive trench plug on the trench plate;
• a channel plate on the conductive trench plug;
• conductive channel plug on the channel plate;
• and
• a barrier layer on the conductive channel plug, channel plate, conductive trench plug, and trench plate.

A top via comprising:

• a first etch stop layer on a fill layer;
• a conductive line in the fill layer;
• a trench plate on a conductive line, wherein there is a gap between the first etch stop layer and the trench plate;
• a conductive trench plug on the trench plate;
• a channel plate on the conductive trench plug;
• a conductive channel plug on the channel plate;
• and
• a harrier layer directly on the first etch stop layer, conductive line, conductive channel plug, channel plate, conductive trench Ow, and trench plate.