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US 11,894,255 B2Granted
Sheath and temperature control of process kit
AssigneeApplied Materials, Inc.
InventorsJaeyong Cho, Kartik Ramaswamy, Daniel Sang Byun
Life of this patent
Estimating the term…
Abstract
Embodiments of a process kit are provided herein. In some embodiments, a process kit for use in a substrate processing chamber includes: a ceramic ring having an upper surface and a lower surface, wherein the ceramic ring includes a chucking electrode disposed in the ceramic ring and a heating element disposed in the ceramic ring; and an edge ring disposed on the ceramic ring.
Claims20
A process kit for use in a substrate processing chamber, comprising:
- a ceramic plate having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic plate includes an electrode embedded in the ceramic plate;
- a first cooling plate coupled to the second side of the ceramic plate;
- a ceramic ring disposed about the ceramic plate and having a first side and a second side opposite the first side, wherein the ceramic ring includes one or more chucking electrodes and a heating element disposed in the ceramic ring, wherein the ceramic ring is spaced apart from the ceramic plate and the first cooling plate;
- an edge ring disposed on the ceramic ring;
- a second cooling plate coupled to the second side of the ceramic ring, wherein the second cooling plate is a ring disposed about the first cooling plate with a gap disposed between the first cooling plate and the second cooling plate;
- wherein the second cooling plate is thermally isolated from the first cooling plate;
- wherein the first cooling plate and the second cooling plate include coolant channels configured to circulate a coolant, wherein the coolant channels of the first cooling plate are fluidly independent from the coolant channels of the second cooling plate;
- a first gas channel extending from the first side to the second side of the ceramic plate;
- a second gas channel extending from the first side to the second side of the ceramic ring;
- and
- one or more sealing elements disposed between:
- the ceramic ring and the second cooling plate;
- the first cooling plate and the second cooling plate;
- and
- the ceramic ring and the edge ring, dimensioned and arranged to prevent a gas flow from the second gas channel into the gap disposed between the first cooling plate and the second cooling plate.
12 more elements
A substrate support for use in a substrate processing chamber, comprising:
- a ceramic plate having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic plate includes an electrode embedded in the ceramic plate;
- a first cooling plate coupled to the second side of the ceramic plate;
- a ceramic ring disposed about the ceramic plate and having a first side and a second side opposite the first side, wherein the ceramic ring includes one or more chucking electrodes and a heating element disposed in the ceramic ring, wherein the ceramic ring is spaced apart from the ceramic plate and the first cooling plate;
- an edge ring disposed on the ceramic ring;
- a second cooling plate coupled to the second side of the ceramic ring, wherein the second cooling plate is a ring disposed about the first cooling plate with a gap disposed between the first cooling plate and the second cooling plate;
- wherein the second cooling plate is thermally isolated from the first cooling plate;
- wherein the first cooling plate and the second cooling plate include coolant channels configured to circulate a coolant, wherein the coolant channels of the first cooling plate are fluidly independent from the coolant channels of the second cooling plate;
- a first gas channel extending from the first side to the second side of the ceramic plate;
- a second gas channel extending from the first side to the second side of the ceramic ring;
- and
- one or more sealing elements disposed between:
- the ceramic ring and the second cooling plate;
- the first cooling plate and the second cooling plate;
- and
- the ceramic ring and the edge ring, dimensioned and arranged to prevent a gas flow from the second gas channel into the gap disposed between the first cooling plate and the second cooling plate.
12 more elements
A process chamber, comprising:
- a chamber body having a substrate support disposed within an inner volume of the chamber body, wherein the substrate support includes:
- a ceramic plate having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic plate includes an electrode embedded in the ceramic plate;
- a first cooling plate coupled to the second side of the ceramic plate;
- a ceramic ring disposed about the ceramic plate and having a first side and a second side opposite the first side, wherein the ceramic ring includes one or more chucking electrodes and a heating element disposed in the ceramic ring,
- wherein the ceramic ring is spaced apart from the ceramic plate and the first cooling plate;
- an edge ring disposed on the ceramic ring;
- a second cooling plate coupled to the second side of the ceramic ring, wherein the second cooling plate is a ring disposed about the first cooling plate with a gap disposed between the first cooling plate and the second cooling plate;
- wherein the second cooling plate is thermally isolated from the first cooling plate;
- wherein the first cooling plate and the second cooling plate include coolant channels configured to circulate a coolant, wherein the coolant channels of the first cooling plate are fluidly independent from the coolant channels of the second cooling plate;
- a first gas channel extending from the first side to the second side of the ceramic plate;
- a second gas channel extending from the first side to the second side of the ceramic ring;
- and
- one or more sealing elements disposed between:
- the ceramic ring and the second cooling plate;
- the first cooling plate and the second cooling plate;
- and
- the ceramic ring and the edge ring, dimensioned and arranged to prevent a gas flow from the second gas channel into the gap disposed between the first cooling plate and the second cooling plate;
- and
- a power source coupled to the heating element to control a temperature of the ceramic ring independent of the temperature of the ceramic plate.
16 more elements
Dependencies are inferred from the claim text.