Wafer system-level fan-out packaging structure and manufacturing method

A method for manufacturing a wafer system-level fan-out packaging structure, comprising:

• providing a first carrier substrate and a release layer on the first carrier substrate;
• forming a redistribution layer, wherein the redistribution layer comprises a first surface and a second surface opposite to each other, wherein the first surface of the redistribution layer is placed on the release layer;
• bonding a patch element to the second surface of the redistribution layer;
• providing a die having a bump disposed on a front side, and bonding the front side of the die to the second surface of the redistribution layer by the bump;
• forming a plastic packaging layer on the second surface of the redistribution layer, wherein the plastic packaging layer covers the patch element, a back side and side surfaces of the die;
• forming a second carrier substrate, wherein the second carrier substrate is bonded to the plastic packaging layer;
• bonding the second carrier substrate to the plastic packaging layer;
• and
• removing the first carrier substrate and the release layer to expose the first surface of the redistribution layer;
• forming a solder bump on the first surface of the redistribution layer;
• and
• removing the second carrier substrate.