Back to results
US 11,894,242 B2Granted
Semiconductor package and method of manufacturing semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsTaeyoung Kim, Seokhong Kwon, Wonyoung Kim, Jinchan Ahn
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, a molding member on the package substrate to cover at least a portion of the semiconductor chip, and a mechanical reinforcing member provided around the semiconductor chip within the molding member and extending in at least one direction.
Claims20
A method of manufacturing a semiconductor package, the method comprising:
- disposing a semiconductor chip on a substrate;
- disposing the substrate in a cavity between a lower mold and an upper mold of a molding apparatus;
- after disposing the substrate in the cavity, a mechanical reinforcing pattern around the semiconductor chip within the cavity such that the mechanical reinforcing pattern is suspended at a predetermined height from the substrate;
- injecting a molding material into the cavity;
- and
- curing the molding material within the cavity.
3 more elements
A method of manufacturing a semiconductor package, the method comprising:
- disposing a semiconductor chip on a substrate;
- after disposing the semiconductor chip on the substrate, positioning a mechanical reinforcing pattern around the semiconductor chip, the mechanical reinforcing pattern to be suspended at a predetermined height from the substrate;
- and
- forming a molding material on the substrate to cover at least a portion of the semiconductor chip and upper and lower sides of the mechanical reinforcing pattern.
1 more element
Dependencies are inferred from the claim text.