Semiconductor packages with die support structure for thin die

A semiconductor device comprising:

• a semiconductor die comprising a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface;
• and
• a temporary die support structure coupled to one of the first largest planar surface or the second largest planar surface;
• wherein the semiconductor die is coupled with one of a substrate, a leadframe, an interposer, a package, a bonding surface, or a mounting surface;
• and
• wherein an outer edge of the temporary die support structure is set in from an outer edge of the semiconductor die.

A semiconductor device comprising:

• a semiconductor die comprising a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface;
• and
• a temporary die support structure coupled to one of the first largest planar surface or the second largest planar surface;
• wherein the semiconductor die is coupled with one of a substrate, a leadframe, an interposer, a package, a bonding surface, or a mounting surface;
• and
• wherein a width of the temporary die support structure is less than a width of the semiconductor die.