Electrostatic chuck, support platform, and plasma processing apparatus
AssigneeTokyo Electron Limited
InventorsMasato Takayama, Yasuharu Sasaki
Life of this patent
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AssigneeTokyo Electron Limited
InventorsMasato Takayama, Yasuharu Sasaki
Estimating the term…
There is provision of an electrostatic chuck for supporting a substrate and an edge ring including a first region, a second region, an electrode provided in the second region, and an elastic member. The first region includes a first top surface and is configured to hold the substrate that is placed on the first top surface. The second region extends in a circumferential direction of the first region so as to surround the first region. The second region includes a second top surface, and is configured to support the edge ring placed on the second top surface. The first top surface and the second top surface extend along a single flat plane. A part of the edge ring is accommodated in a space provided between the first region and the second region, and the elastic member is disposed between the part of the edge ring and the electrostatic chuck.
An electrostatic chuck for supporting a substrate and an edge ring including a first portion and a second portion, the electrostatic chuck comprising:
Dependencies are inferred from the claim text.