Radio frequency identification flat sheet material
AssigneeRfid Paper Sdn Bhd
InventorIvan Sergeevich Demidov
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Abstract
The invention relates to the field of radio-frequency identification, in particular, to materials containing radio-frequency tags in their layers and intended for printing and stamping by commonly available printing methods. The technical result of the invention is to obtain the flexible flat sheet material in which the chips and other electronic components do not affect the level of the sheet material surface flatness. The flat sheet material with radio frequency identification contains the sequentially arranged first layer of flexible material, the first intermediate layer, the substrate layer with an antenna and a chip, the second intermediate layer, the second layer of flexible material, and the first intermediate layer made of the polymer composite.
Claims20
A flat sheet material for radio frequency identification (RFID), comprising:
- a first layer of flexible material,
- a first intermediate layer on top of the first layer of flexible material,
- a substrate layer on top of the first intermediate layer, the substrate layer comprising an antenna, a chip being mounted on the antenna,
- a second intermediate layer on top of the substrate layer, the second intermediate layer encapsulating the chip, and
- a second layer of flexible material on top of the second intermediate layer,
- wherein the first intermediate layer is made of a polymer composite, and wherein the second intermediate layer is formed by applying the polymer composite in a liquid form between the substrate layer and the second layer of flexible material to cover protruding elements of the substrate layer, and allowing the polymer composite in the liquid state to polymerize.
A flat sheet material comprising a plurality of radio frequency identification (RFID) tags, the flat sheet material comprising:
- a first layer of flexible material;
- a first intermediate layer on top of the first layer of flexible material;
- a substrate layer on top of the first intermediate layer, wherein the substrate layer comprises a plurality of antennae and a plurality of chips, and wherein each chip is mounted on the antenna;
- a second intermediate layer on top of the substrate layer, the second intermediate layer encapulating the plurality of chips;
- and
- a second layer of flexible material on top of the second intermediate layer,
- wherein the second intermediate layer is formed by applying a polymer composite in a liquid form between the substrate and the second layer of flexible material to cover protruding elements of the substrate layer, and allowing the polymer composite in the liquid state to polymerize.
Dependencies are inferred from the claim text.