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US 11,893,440 B2Granted
Card-type substrate having biometric functionality and a method of forming the same
AssigneeLinxens Holding
InventorCaroline Catharina Maria Beelen-Hendrikx
Life of this patent
Estimating the term…
Abstract
A smartcard receives biometric capabilities by incorporating a biometric sensor chip based on a “dual” flip chip bonding technique. In particular embodiments, the sensor chip may be incorporated into the card-type substrate after having completed any high temperature process steps required for laminating the various foil layers of the card-type substrate.
Claims22
A method of adding biometric functionality to a card-type substrate, the method comprising
- providing a biometric chip so as to have a first surface and an opposing second surface, said first surface having formed thereon chip contact elements;
- connecting said biometric chip to a chip receiving substrate by at least one of gluing and soldering said chip contact elements to a corresponding first set of substrate contact elements formed on a contact surface of said chip receiving substrate;
- and
- connecting said chip receiving substrate to said card-type substrate by at least one of gluing and soldering a second set of substrate contact elements of said chip receiving substrate to card contact elements of said card-type substrate,
- wherein said chip receiving substrate is provided with an opening to expose at least a portion of said first surface of said biometric chip after being connected to said chip-receiving substrate.
2 more elements
A smart card, comprising
- a card substrate including a cavity and a plurality of card contact elements provided in said cavity;
- a biometric chip positioned in said cavity and including a plurality of chip contact elements;
- and
- a chip receiving substrate including a first set of contact elements and a second set of contact elements formed on a cavity-side surface, said chip receiving substrate covering at least a portion of said cavity,
- wherein said plurality of chip contact elements is directly mechanically and electrically connected to said first set of contact elements and said plurality of card contact elements is directly electrically and mechanically connected to said second set of contact elements, and
- wherein said chip receiving substrate comprises an opening aligned to a sensor surface portion of said biometric chip.
3 more elements
Dependencies are inferred from the claim text.