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US 11,892,966 B2Granted
Multi-use chip-to-chip interface
AssigneeXilinx, Inc.
InventorsKrishnan Srinivasan, Ygal Arbel, Sagheer Ahmad
Life of this patent
Estimating the term…
Abstract
Systems, methods, and apparatuses are described that enable IC architectures to enable a single anchor to connect to and accept a variety of chiplets at any port by way of a programming model that enables the anchor or chiplet to dynamically adapt to configurations, requirements, or aspects of any coupled component and provide an interface for the coupled components.
Claims20
An integrated circuit (IC), comprising:
- an anchor IC comprising a:
- a processor IC;
- and
- a memory IC configured to store one or more programs that, when executed by the processor IC, perform one or more operations;
- a plurality of chiplet ICs configured to provide a function when coupled with the anchor IC via a plurality of chip-to-chip (C2C) interfaces residing in the anchor IC and the chiplet ICs, each chiplet IC comprising:
- one or more requirements for a corresponding C2C interface of the plurality of C2C interfaces via which the chiplet IC connects to the anchor IC;
- and
- one or more performance requirements for the anchor IC, and wherein each of the plurality of C2C interfaces of the anchor IC is configured to:
- receive data from one chiplet IC of the plurality of chiplet ICs regardless of a functionality of the one chiplet;
- and
- individually couple the one chiplet IC to the anchor IC;
- and
- wherein the one or more operations comprise a programmable option for the anchor IC to interface in different combinations and arrangements of the chiplet ICs to provide different functions.
10 more elements
An electronic device, comprising:
- an anchor integrated circuit (IC) die;
- a plurality of chiplet IC dies configured to provide a function when coupled to the anchor IC die via a plurality of chip-to-chip (C2C) interfaces, each chiplet IC die comprising:
- one or more requirements for a corresponding C2C interface of the plurality of C2C interfaces via which the chiplet IC die couples to the anchor IC die;
- and
- one or more performance requirements for the anchor IC die, and the plurality of C2C interfaces, each C2C interface configured to:
- receive data from one chiplet IC die of the plurality of chiplet IC dies regardless of a functionality of the one chiplet IC die;
- and
- individually couple the one chiplet IC die to the anchor IC die to form a multi-die IC device;
- wherein the C2C interface comprises a protocol selected from the group consisting of a streaming protocol, an Advanced eXtensible Interface (AXI-MM) and a pass-through protocol selected by registers of the C2C interface, the protocol configured to enable the anchor IC die to interface in different combinations and arrangements with the plurality of chiplet IC dies to configure features and functions of the electronic device.
6 more elements
A method comprising:
- configuring each chiplet integrated circuit (IC) die of a plurality of chiplet IC dies to provide a corresponding function when coupled to an anchor IC die via a plurality of corresponding chip-to-chip (C2C) interfaces;
- configuring each chiplet IC of the plurality of chiplet IC dies to have one or more requirements for corresponding C2C interface of the plurality of C2C interfaces via which the chiplet IC die couples to the anchor IC die;
- configuring each chiplet IC die of the plurality of chiplet IC dies to have one or more performance requirements for the anchor IC die;
- configuring each C2C interface of the plurality of C2C interfaces to:
- receive one chiplet IC die of the plurality of chiplet IC dies regardless of a functionality of the one chiplet IC die;
- and
- individually couple the one chiplet IC die to the anchor IC die to form a multi-die IC device;
- and
- configuring the anchor IC die to provide one or more programmable options to interface in different combinations and arrangements with the plurality of chiplet IC dies to configure features and functions of a device comprising the anchor IC die and the chiplet IC dies.
6 more elements
Dependencies are inferred from the claim text.