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US 11,892,703 B2Granted
Haptic feedback system
AssigneeTDK Taiwan Corp.
InventorsYi-Ho Chen, Ying-Jen Wang, Ya-Hsiu Wu
Life of this patent
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Abstract
A haptic feedback system is provided, including a sensing unit, a haptic feedback module, and a circuit assembly. The sensing unit is configured to detect contact with an object. The haptic feedback module is configured to transfer the contact force to the sensing unit. The circuit assembly is electrically connected to the sensing unit and the haptic feedback module.
Claims17
A haptic feedback system, comprising:
- a sensing unit, configured to detect contact with an object;
- a haptic feedback module, configured to transfer a contact force to the sensing unit;
- and
- a circuit assembly, electrically connected to the sensing unit and the haptic feedback module,
- wherein the haptic feedback module comprises a fixed part, a movable part movably connected to the fixed part, and a driving mechanism electrically connected to the circuit assembly for driving the movable part to move relative to the fixed part,
- wherein the sensing unit transmits a sensing signal to the circuit assembly, and the circuit assembly transmits a driving signal to the driving mechanism according to the sensing signal, whereby the movable part is driven to move relative to the fixed part and contacts the sensing unit,
- wherein the fixed part has an opening, and when the movable part is driven to move relative to the fixed part, the movable part extends through the opening and contacts the sensing unit,
- wherein the fixed part comprises a housing and a base, the housing has a top portion and at least a sidewall connected to the top portion, the opening is formed on the top portion, the base is connected to the housing, and the movable part is disposed between the housing and the base, and
- wherein the movable part has at least a stopper protruding toward the housing, and when the movable part moves relative to the fixed part to a limit position, the stopper contacts the top portion to restrict the movable part in the limit position.
6 more elements
A haptic feedback system, comprising:
- a sensing unit, configured to detect contact with an object;
- a haptic feedback module, configured to transfer a contact force to the sensing unit;
- and
- a circuit assembly, electrically connected to the sensing unit and the haptic feedback module,
- wherein the haptic feedback module comprises a fixed part, a movable part, movably connected to the fixed part, and a driving mechanism electrically connected to the circuit assembly for driving the movable part to move relative to the fixed part,
- wherein the sensing unit transmits a sensing signal to the circuit assembly, and the circuit assembly transmits a driving signal to the driving mechanism according to the sensing signal, whereby the movable part is driven to move relative to the fixed part and contacts the sensing unit, and
- wherein the sensing unit includes a protective element, a sensing element, and a circuit element electrically connecting the sensing element to the circuit assembly, wherein the sensing element is disposed between the protective element and the circuit element.
4 more elements
A haptic feedback system, comprising:
- a sensing unit, configured to detect contact with an object;
- a haptic feedback module, configured to transfer a contact force to the sensing unit;
- and
- a circuit assembly, electrically connected to the sensing unit and the haptic feedback module,
- wherein the haptic feedback module comprises a fixed part, a movable part, movably connected to the fixed part, and a driving mechanism electrically connected to the circuit assembly for driving the movable part to move relative to the fixed part,
- wherein the sensing unit transmits a sensing signal to the circuit assembly, and the circuit assembly transmits a driving signal to the driving mechanism according to the sensing signal, whereby the movable part is driven to move relative to the fixed part and contacts the sensing unit, and
- wherein the driving mechanism comprises a shape memory alloy element that is electrically connected to the circuit assembly, and the movable part is movably connected to the fixed part via the shape memory alloy element.
4 more elements
Dependencies are inferred from the claim text.