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US 11,892,690 B1Granted
Optoelectronic ball grid array package with fiber
AssigneeAcacia Communications, Inc.
InventorChristopher Doerr
Life of this patent
Estimating the term…
Abstract
A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.
Claims12
A method, comprising:
- packaging a photonic integrated circuit (PIC) in a package comprising a substrate and a lid, the substrate having a first surface and a second surface opposite the first surface of the substrate, the PIC having a first surface;
- mounting a fiber holder on the lid of the package such that the lid is between the PIC and the fiber holder, wherein the first surface of the substrate is proximate the first surface of the PIC and the second surface of the substrate is distal the first surface of the PIC;
- coupling an optical fiber to the PIC, the lid contacting the first surface of the substrate and at least partially covering the PIC;
- and
- mechanically coupling the optical fiber to the fiber holder.
2 more elements
Dependencies are inferred from the claim text.