Through-silicon via (TSV) fault-tolerant circuit, method for TSV fault-tolerance and integrated circuit (IC)
AssigneeChangxin Memory Technologies, Inc.
InventorCheng-Jer Yang
Life of this patent
Estimating the term…
Abstract
An integrated circuit with a through-silicon via (TSV) fault-tolerant circuit, a TSV fault tolerance method are disclosed. The IC may include a plurality of operational TSVs, a spare TSV, a plurality of fault-tolerance control modules each coupled to one of the plurality of operational TSVs and the spare TSV, and a decoder coupled to the fault-tolerance control modules. The fault-tolerance control modules may be configured to deactivate an operational TSV that is determined to be defective and activate the spare TSV based on a positioning code for the defective operational TSV from the decoder. The IC may reduce the defect rate in the fabrication of TSV-based three-dimensional (3D) IC chips.
Claims14
An integrated circuit (IC), comprising:
- a plurality of operational TSVs;
- a spare TSV;
- a plurality of fault-tolerance control modules, each coupled to one of the plurality of operational TSVs and the spare TSV;
- and
- a decoder, coupled to the plurality of fault-tolerance control modules,
- wherein the plurality of fault-tolerance control modules are configured to deactivate one of the plurality of operational TSVs that is determined to be defective and activate the spare TSV based on a positioning code for the defective operational TSV from the decoder,
- wherein each of the plurality of fault-tolerance control modules comprises:
- an input control unit, coupled to an input of one of the plurality of operational TSVs and an input of the spare TSV,
- wherein the input control unit is configured to deactivate the operational TSV that is determined to be defective and activate the spare TSV based on the positioning code for the defective operational TSV from the decoder.
Dependencies are inferred from the claim text.