Current sensor package

An apparatus, comprising:

• a leadframe having a first portion, a second portion, and a third portion, the first portion of the leadframe being contiguous with respect to the second portion of the leadframe and the third portion of the leadframe, the first portion of the leadframe being disposed between the second portion of the leadframe and the third portion of the leadframe and configured to carry a current between the second portion and the third portion, the first potion, the second potion, and the third portion of the leadframe being defined by a first notch and a second notch that are formed on opposite sides of the leadframe, the first notch and the second notch being so shaped as to cause the first portion in the leadframe to extend at an angle relative to the second portion of the leadframe and the third portion of the leadframe;
• a current sensor that is electrically isolated from the leadframe, the current sensor being disposed above or below the first portion of the leadframe;
• and
• an encapsulating material that is configured to encapsulate the current sensor and at least a part of the first portion of the leadframe that is situated directly above or below the current sensor.

An apparatus, comprising:

• a leadframe having a first portion, a second portion, and a third portion, the first portion of the leadframe being disposed between the second portion of the leadframe and the third portion of the leadframe, the first portion including a through-hole that is formed therein;
• a current sensor that is electrically isolated from the leadframe;
• and
• an encapsulating material that is configured to encapsulate the current sensor and at least a part of the first portion of the leadframe that includes the through-hole,
• wherein the leadframe includes a first notch and a second notch that are formed on opposite sides of the leadframe, and
• wherein the first notch and the second notch are so shaped as to cause the first portion to extend at an angle relative to the second portion and the third portion of the leadframe.

A method, comprising:

• providing a leadframe having a first portion, a second portion, and a third portion, the first portion of the leadframe being contiguous with respect to the second portion of the leadframe and the third portion of the leadframe, the first portion ofthe leadframe being disposed between the second portion of the leadframe and the third portion of the leadframe and configured to carry a current between the second portion and the third portion, the first portion of the leadframe being disposed at a non-zero angle relative to at least one of the second portion of the leadframe and the third portion of the leadframe, the first port of the leadframe being formed in a same plane as the second portion of the leadframe and the third portion of the leadframe;
• providing a current sensor that is electrically isolated from the leadframe, the current sensor being disposed above or below the first portion of the leadframe;
• and
• encapsulating the current sensor and at least a part of the first portion of the leadframe that is situated directly above or below the current sensor in encapsulating material.