# US 11,892,249 B2 · Heat dissipation table made of alloy material and with special waterway design

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- Number: US 11,892,249 B2
- Document ID: US11892249B2
- Status: Granted
- Kind: B2
- Application number: 17/843,847
- Filed: 2022-06-17
- Published: 2023-01-19
- Granted: 2024-02-06
- Earliest claimed: 2021-07-14
- Assignees: Shanghai Worldiray Semiconductor Technology Co., Ltd.
- Applicants: Shanghai Worldiray Semiconductor Technology Co., Ltd.
- Inventors: Changqing Hu; Jianhai Zhao
- Web page: https://patentgrep.com/patent/US11892249B2

## CPC

- F28F 21/085: {from copper or copper alloys}
- C22C 9/02: with tin as the next major constituent
- Y02B 30/00: Energy efficient heating, ventilation or air conditioning [HVAC]
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS

## Abstract

The present invention discloses a heat dissipation table made of an alloy material and with a special waterway design, comprising a sample placing table, a graphene heating structure abutted against the sample placing table, a heat dissipation structure abutted against the graphene heating structure and a protective cover for wrapping the heat dissipation structure. The heat dissipation structure comprises a heat dissipation table abutted against the graphene heating structure and a heat dissipation pipeline communicated with the heat dissipation table; a water pipe through groove is formed in the middle part of the heat dissipation table; and the heat dissipation pipeline is embedded into the water pipe through groove. A plurality of waterway annular grooves are formed in the heat dissipation table and communicated with the water pipe through groove. According to the present invention, the demand of diamonds on heat dissipation with high power can be met, and the cost is low.

## Claims

### Claim 1

A heat dissipation apparatus comprising:
a sample placing table having a top surface for supporting a substrate during processing of the substrate and a bottom surface;
a heating structure formed separately from the sample placing table and comprising a first graphene piece having a top surface contacting the bottom surface of the sample placing table and a bottom surface, a second graphene piece having a top surface opposing the bottom surface of the first graphene piece and a bottom surface, and a heating wire disposed between the first and second graphene pieces, the heating structure having a through hole extending through both graphene pieces from the top surface of the first graphene piece to the bottom surface of the second graphene piece;
a heat dissipation table formed separately from the heating structure and having a top surface contacting the bottom surface of the second graphene piece and a bottom surface, the heat dissipation table having a through hole extending from the top surface to the bottom surface of the heat dissipation table and forming a channel together with the through hole in the heating structure, and a plurality of annular waterway grooves formed inside the heat dissipation table and fluidly communicating with the through hole in the heat dissipation table;
a heat dissipation pipeline having an upper end embedded in the through hole in the heat dissipation table and a lower end extending out of the heat dissipation table; and
a protective cover surrounding the heat dissipation table.

### Claim 2 (depends on 1)

The heat dissipation apparatus according to claim 1, wherein a circular groove is formed in an outer periphery of the heat dissipation table, and the protective cover is embedded in the groove.

### Claim 3 (depends on 1)

The heat dissipation apparatus according to claim 1, wherein the waterway grooves are disposed adjacent to each other and are annularly arranged along an end surface of the heat dissipation table.

### Claim 4 (depends on 1)

The heat dissipation apparatus according to claim 1, wherein the heat dissipation table is made of a copper-tin alloy.

### Claim 5 (depends on 1)

The heat dissipation apparatus according to claim 1, wherein the first and second graphene pieces are secured to each other at an outer peripheral region of the heat dissipation structure and are separated from each other by the heating wire between the through hole in the heat dissipation structure and the outer peripheral region.

### Claim 6 (depends on 1)

The heat dissipation apparatus according to claim 1, wherein the heat dissipation pipeline has an inner channel extending in an axial direction of the pipeline and an outer channel surrounding the inner channel and extending in the axial direction of the pipeline.