Heat pump device and assembly

A temperature control assembly for a thermal cycling of a multi-receptacle sample block, the assembly comprising:

• one or more thermoelectric devices comprising one or more thermoelectric elements operably coupled between an active face for thermal coupling with the sample block and a reference face for thermal coupling with a heat sink;
• a heat sink comprising a slab of thermally conductive material having a raised portion with a top surface thermally coupled with a planar face of the one or more thermoelectric devices, wherein the raised portion includes:
• an outer periphery of a rectangular shape that is co-extensive with the planar face of the one or more thermoelectric devices,
• a central raised region defined in a shape corresponding to an uneven temperature distribution, and
• a void region between the outer periphery and the central raised region, wherein the void region surrounds the central raised region,
• one or more supports comprising a material having a lower thermal conductivity than the slab, wherein the one or more supports are disposed within the void region so as to support the planar face of the one or more thermoelectric elements facing the void region, and
• a plurality of heat dissipating fins thermally coupled with an underside of the slab opposite the raised portion of the slab.