Substrate processing apparatus
AssigneeKokusai Electric Corporation
InventorsNaofumi Ohashi, Takashi Yahata, Yukinori Aburatani, Shun Matsui
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Abstract
There is provided a technique that includes: a process chamber in which a substrate is processed; a gas supplier configured to supply a gas into the process chamber; at least one substrate mounting table disposed in the process chamber and including a substrate mounting surface on which the substrate is mounted; and an arm configured to transfer the substrate to the substrate mounting surface while supporting a lower surface of the substrate, wherein the arm includes a support that includes an inclination and is configured to support the substrate.
Claims13
A substrate processing apparatus, comprising:
- a process chamber in which a substrate is processed;
- a gas supplier configured to supply a gas into the process chamber;
- at least one substrate mounting table disposed in the process chamber and including a substrate mounting surface on which the substrate is mounted;
- and
- an arm configured to transfer the substrate to the substrate mounting surface while supporting a lower surface of the substrate,
- wherein the arm includes a support that is formed to be inclined and has an upper end and a lower end, and
- wherein the arm further includes a curved portion that is curved upward at the lower end of the support and that has a radius of curvature such that the curved portion is not in contact with an outer peripheral sidewall of the substrate when the substrate is supported by the support.
Dependencies are inferred from the claim text.