Composition, low halogen and fast curing conductive adhesive and its preparation method

A composition for preparing a low halogen and fast curing conductive adhesive, characterized in that, it is composed of the following raw materials measured by weight:

• epoxy resin 5-15 parts, curing agent 0.5-3 parts, acrylic acid component 5-12 parts, initiator 0.5-2 parts, flexibilizer 2-5 parts, wetting dispersant 0.1-1 parts, coupling agent 0.1-1 parts, antioxidant 0.1-1 parts, defoamer 0.1-1 parts and conductive silver filler 75-85 parts;
• the epoxy resin is at least one selected from electronic grade low halogen bisphenol-A epoxy resin, bisphenol-F epoxy resin, dicyclopentadienol epoxy resin and naphthol epoxy resin;
• the acrylic acid component is acrylic monomers with a molecular weight of 100 to 400 and a hydrophobic structure;
• the acrylic monomers are at least one selected from phenoxybenzyl acrylate, 2-ethylhexyl acrylate, isobornyl acrylate, dicyclopentadienol acrylate, trimethylolpropanetriacrylate, methyl methacrylate, cyclohexyl methacrylate, isobornyl 2-methyl-2-propenoate, benzyl methacrylate, glycidyl methacrylate, and trihydroxymethylcyclohexyl methacrylate;
• the flexibilizer is electronic grade bisphenol-F epoxy resin modified by nano silica or core-shell structural rubber particles;
• the conductive silver filler consists of flaky silver powders, near spherical silver powders, and nanometer silver powders.