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US 11,891,475 B2Granted
SMA resin formulation
AssigneeIsola USA Corp.
InventorsEdward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, Jr.
Life of this patent
Estimating the term…
Abstract
Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
Claims17
A resin composition comprising:
- styrene maleic anhydride co-polymer;
- at least one epoxy resin;
- at least one cross-linking agent;
- talc present in the resin in an amount ranging from bout 2.5 to about 15 wt % on a dry basis;
- and
- silica present in the resin in an amount ranging from about 2.5 to about 25 wt % on a dry basis;
- wherein the weight ratio of silica to talc is in the range from about 1:2.5 to about 5:1.
4 more elements
A resin composition comprising:
- from about 15 to about 35 wt % on a dry solvent free resin basis of a styrene maleic anhydride co-polymer;
- from about 5 to about 45 wt % on a dry solvent free resin basis of at least one epoxy resin selected from a brominated bisphenol A epoxy resin, a brominated bisphenol F epoxy resin, a non-brominated bisphenol A epoxy resin, a non-brominated bisphenol F epoxy resin or a combinations thereof;
- from about greater than 0.5 to about 10 wt % on a dry solvent free resin basis of at least one cross-linking agent selected from tetrabromobisphenol A, tetra-DOPO-bisphenol A and mixtures thereof;
- from about 2.5 to about 12.5 wt % on a dry resin basis of talc;
- and
- from about 2.5 to about 12.5 wt % on a dry resin basis of fumed silica.
3 more elements
Dependencies are inferred from the claim text.