Curable resin composition, dry film, resin-clad copper foil, cured product, and electronic component

A curable resin composition, comprising:

• an epoxy resin;
• an inorganic filler:
• a curing accelerator;
• and
• a compound having an active ester group,
• wherein the curing accelerator includes at least one selected from the group consisting of an imidazole, an imidazole derivative, and an amine, a ratio of the total amount of epoxy groups in the epoxy resin/the total amount of active ester groups in the compound having an active ester group in the curable resin composition is in a range of 0.2 to 0.6, the epoxy resin includes a biphenyl aralkyl type epoxy resin and at least one compound selected from the group consisting of bisphenol A type epoxy resin and bisphenol F type epoxy resin, the compound having an active ester group is selected from the group consisting of a compound of formula (1),
• where each X1, independently from each other, is a group having a benzene ring or a naphthalene ring, k is 0 or 1, and n as an average number of repeating units is in a range of 0.25 to 1.5, and a compound having a structural moiety of formula (2),
• where the compound having the structural moiety of the formula (2) has a structure with monovalent aryloxy groups at both ends thereof, m is an integer in a range of 1 to 6, each n, independently from each other, is an integer in a range of 1 to 5, and each q, independently from each other, is an integer in a range of 1 to 6, and each X2, independently from each other, is a group of formula (3),
• where each k, independently from each other, is an integer in a range of 1 to 5, or a group of formula (4),
• where Y is a group of the formula (3), each k, independently from each other, is an integer in a range of 1 to 5, and each t, independently from each other, is an integer in a range of 0 to 5.