Method for manufacturing three-dimensional structure, and three-dimensional structure

A method for manufacturing a three-dimensional structure comprising:

• preparing a first structure including a fixing face;
• fixing a plastic layer to the fixing face of the first structure;
• preparing a conductive wire;
• and
• operating an ultrasonic head to apply ultrasonic waves to the conductive wire and to press the conductive wire against the plastic layer, and thereby partly embedding the conductive wire into the plastic layer, wherein
• the fixing of the plastic layer includes
• placing the first structure into a cavity of a first molding die,
• injecting molten plastic onto the fixing face of the first structure in the cavity of the first molding die, and
• solidifying the molten plastic to mold the plastic layer on the fixing face of the first structure,
• the molding of the plastic layer includes
• placing at least a part of an embedded portion of a terminal into the cavity of the first molding die and inserting an external connection portion of the terminal into an accommodation hole communicating with the cavity of the first molding die,
• inserting at least the part of the embedded portion of the terminal into the molten plastic injected into the cavity of the first molding die, and
• solidifying the molten plastic to insert-mold at least the part of the embedded portion of the terminal into the plastic layer,
• the method further includes electrically connecting the terminal to the conductive wire,
• the plastic layer includes a first face in contact with the fixing face of the first structure and a second face opposite to the first face,
• a binder layer is provided on the embedded portion of the terminal,
• the insert-molding of the embedded portion of the terminal includes insert-molding the embedded portion of the terminal into the plastic layer such that an exposed face of the binder layer is substantially flush with the second face of the plastic layer,
• the embedding of the conductive wire includes
• operating the ultrasonic head to apply ultrasonic waves onto the conductive wire and to press the conductive wire against the second face of the plastic layer, and thereby partly embedding the conductive wire into the second face of the plastic layer, and
• operating the ultrasonic head to apply ultrasonic waves onto the conductive wire and bringing the conductive wire partly into contact with the exposed face of the binder layer, and
• the electrical connecting of the terminal to the conductive wire includes melting the binder layer and partly exposing the embedded portion of the terminal from the binder layer to connect the conductive wire to the embedded portion of the terminal by heat swaging, welding, or soldering.