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US 11,890,722 B2Granted
Chemical mechanical polishing slurry buildup monitoring
AssigneeApplied Materials, Inc.
InventorThomas Ho Fai Li
Life of this patent
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Abstract
An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image sensor configured to image the surface, and a processor coupled to the image sensor and configured to monitor slurry buildup on the surface using data supplied from the image sensor.
Claims8
A substrate polishing apparatus, comprising:
- a surface coated at least in part with a fluorescent material;
- a light source configured to illuminate the surface;
- an image sensor configured to image the surface, wherein the fluorescent material is applied to areas of interest on a plurality of surfaces, and wherein the image sensor comprises one or more cameras configured to image each of the areas of interest simultaneously;
- and
- a processor coupled to the image sensor and configured to monitor slurry buildup on the surface using data supplied from the image sensor.
2 more elements
Dependencies are inferred from the claim text.