Cleaning chemical liquid supply device and cleaning chemical liquid supply method

A cleaning chemical liquid supply method for supplying a chemical liquid for cleaning a substrate to a cleaning device, the cleaning chemical liquid supply method comprising:

• a process of controlling flow rates of a first chemical liquid and dilution water while supplying the first chemical liquid and the dilution water to a first mixer;
• a process of supplying the first chemical liquid after dilution to a first position of the substrate from the first mixer through a first nozzle;
• a process of controlling flow rates of the first chemical liquid and the dilution water while supplying the first chemical liquid and the dilution water to a second mixer;
• a process of supplying the first chemical liquid after dilution to a second position, differing from the first position, of the substrate from the second mixer through a second nozzle;
• a process of controlling flow rates of a second chemical liquid and the dilution water while supplying the second chemical liquid and the dilution water to a third mixer;
• a process of supplying the second chemical liquid after dilution to a third position of the substrate from the third mixer through a third nozzle;
• a process of controlling flow rates of the second chemical liquid and the dilution water while supplying the second chemical liquid and the dilution water to a fourth mixer;
• and
• a process of supplying the second chemical liquid after dilution to a fourth position, differing from the third position, of the substrate from the fourth mixer through a fourth nozzle,
• wherein one of the first chemical liquid and the second chemical liquid is an alkaline chemical liquid, and the other is an acid chemical liquid,
• wherein the first position of the substrate is on an upper surface of the substrate,
• the second position of the substrate is on a lower surface of the substrate,
• the third position of the substrate is on the upper surface of the substrate,
• the fourth position of the substrate is on the lower surface of the substrate, and
• wherein a concentration of the first chemical liquid supplied to the first position of the substrate from the first mixer is higher than a concentration of the first chemical liquid supplied to the second position of the substrate from the second mixer, and a flow rate of the first chemical liquid supplied to the first position of the substrate from the first mixer is higher than a flow rate of the first chemical liquid supplied to the second position of the substrate from the second mixer;
• and
• a concentration of the second chemical liquid supplied to the third position of the substrate from the third mixer is higher than a concentration of the second chemical liquid supplied to the fourth position of the substrate from the fourth mixer, and a flow rate of the second chemical liquid supplied to the third position of the substrate from the third mixer is higher than a flow rate of the second chemical liquid supplied to the fourth position of the substrate from the fourth mixer, wherein the first, second, third and fourth positions are disposed in a same cleaning tank.