Integrated assemblies and methods of forming integrated assemblies
AssigneeMicron Technology, Inc.
InventorsDavid K. Hwang, Richard J. Hill, Gurtej S. Sandhu
Life of this patent
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AssigneeMicron Technology, Inc.
InventorsDavid K. Hwang, Richard J. Hill, Gurtej S. Sandhu
Estimating the term…
Some embodiments include an integrated assembly having first conductive structures extending along a first direction. Spaced-apart upwardly-opening container-shapes are over the first conductive structures. Each of the container-shapes has a first sidewall region, a second sidewall region, and a bottom region extending from the first sidewall region to the second sidewall region. Each of the first and second sidewall regions includes a lower source/drain region, an upper source/drain region, and a channel region between the upper and lower source/drain regions. The lower source/drain regions are electrically coupled with the first conductive structures. Second conductive structures extend along a second direction which crosses the first direction. The second conductive structures have gate regions operatively adjacent the channel regions. Storage elements are electrically coupled with the upper source/drain regions. Some embodiments include methods of forming integrated assemblies.
An integrated assembly, comprising:
An integrated assembly, comprising:
A method of forming an integrated assembly, comprising:
Dependencies are inferred from the claim text.