Thermal management system with phase change and auxiliary cooling systems
AssigneeBaidu USA LLC
InventorTianyi Gao
Life of this patent
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Abstract
A thermal management system includes a cooling unit, a condenser, and a processor. The processor is located within a server, and the system also includes a phase change cooling device in thermal communication with the processor, and in fluid communication with the condenser. The system also includes a single phase cooling device in thermal communication with the phase change cooling device, and in fluid communication with the liquid cooling unit. The system also includes a temperature sensor in thermal communication with the single phase cooling device, and a fluid pump to move fluid between the liquid cooling unit and the single phase cooling device. A TEC device may also be implemented between the phase change cooling device and the single phase cooling device.
Claims10
A thermal management system comprising:
- a liquid cooling unit comprising a cooling plate that includes at least one of an air-cooled heatsink or a liquid loop housing a cooling liquid;
- a condenser;
- a processor located within a server;
- a phase change cooling device having a phase change plate housing a phase change fluid that is in thermal communication with the processor, and in fluid communication with the condenser;
- a single phase cooling device having a flow path housing a single-phase liquid to place the single-phase liquid in thermal communication with the phase change cooling device, and in fluid communication with the liquid cooling unit, wherein the single-phase liquid is thermally coupled to the cooling plate in the liquid cooling unit;
- a temperature sensor in thermal communication with the single phase cooling device;
- and
- a fluid pump to pump fluid between the liquid cooling unit and the single phase cooling device.
Dependencies are inferred from the claim text.