US 11,889,658 B2 · Immersion cooling system having dual fluid delivery loops

Abstract

Immersion cooling system for electronics. The electronics are immersed in immersion tank filled with immersion liquid. A universal supply utilizes a supply panel to fill cooled liquid into the tank. Localized supply utilizes a manifold to deliver cooled liquid to specific devices within the tank. Cooled liquid is delivered via connection of the manifold and the flexible hoses to cooling plates mounted onto the devices. Each of the cooling plates has a cavity for passing cooled liquid, a supply inlet connected to one of the flexible hoses, and an outlet hole releasing the liquid into the tank. The cooled liquid is supplied to the universal supply from a main cooler. The cooled liquid is supplied to the manifold from the main cooler or from a secondary cooler. The immersion tank has a single recirculation outlet to return liquid mixed from both the universal supply and the localized supply.

Claims16

Dependent claims

An immersion cooling system for cooling servers, comprising:

an immersion enclosure having an immersion tank configured for immersing a plurality of boards in liquid;
a supply panel positioned at a bottom the immersion enclosure;
a manifold having a plurality of supply connectors and positioned at a top of the immersion enclosure, wherein liquid delivered into the manifold cannot exit into the immersion tank unless a distribution element in connected to ine of the plurality of supply connectors;
a main inlet connector coupled to the supply panel;
a secondary inlet connector coupled to the manifold;
and,
an outlet connector positioned below the secondary inlet connector.

4 more elements

Dependencies are inferred from the claim text.

Immersion cooling system having dual fluid delivery loops

Life of this patent

Immersion cooling system having dual fluid delivery loops

Life of this patent

Abstract

Claims16