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US 11,889,629 B2Granted
Component carrier comprising embedded magnet stack
AssigneeAT&SAustria Technologie & Systemtechnik AG
InventorsGerald Weidinger, Gerald Weis, Ivan Salkovic, Karl Kirchheimer
Life of this patent
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Abstract
A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.
Claims14
A component carrier, comprising:
- a base material stack having electrically conductive layer structures and at least one electrically insulating layer structure;
- a magnet stack having a plurality of magnetic layers and at least one bonding layer, the at least one bonding layer bonding two respective magnetic layers;
- and
- a coil structure coupled with the magnetic stack;
- wherein the magnet stack is embedded as an inlay within the base material stack, and
- wherein a stacking direction of the magnetic layers and the at least one bonding layer is parallel to a direction of a winding axis of the coil structure.
3 more elements
A method of manufacturing a component carrier, the method comprising:
- providing a base material stack having electrically conductive layer structures and at least one electrically insulating layer structure;
- embedding a magnet stack as an inlay within the base material stack;
- and
- coupling a coil structure with the magnetic stack,
- wherein the magnet stack includes at least two magnetic layers and at least one bonding layer in between bonding the at least two magnetic layers,
- wherein a stacking direction of the magnetic layers and the at least one bonding layer is parallel to a direction of a winding axis of the coil structure.
3 more elements
A method, comprising:
- forming a printed circuit arranged as a base material stack having electrically conductive layer structures and at least one electrically insulating layer structure;
- forming a magnetic stack as an alternating sequence of substantially planar magnetic layers and substantially planar dielectric bonding layers between each pair of adjacent magnetic layers, wherein the planar magnetic layers include a nanocrystalline magnetic material and each bonding layer is thermally stable at least up to 300° C., the magnetic stack having at least one bonding layer bonding two respective planar magnetic layers;
- inserting the magnetic stack as an inlay for embedding into the printed circuit board;
- and
- coupling a coil structure with the magnetic stack;
- wherein a stacking direction of the magnetic layers and the at least one bonding layer is parallel to a direction of a winding axis of the coil structure.
3 more elements
Dependencies are inferred from the claim text.