Module and method of manufacturing the same
AssigneeMurata Manufacturing Co., Ltd.
InventorAkio Katsube
Life of this patent
Estimating the term…
Abstract
A module includes: a wiring board as a ceramic board having a first main surface; a first component and a second component that are mounted on the first main surface; at least one conductive member disposed on the first main surface between the first component and the second component; a sealing resin that seals the first component, the second component, and the conductive member; and a shield film that covers an upper surface and a side surface of the sealing resin and a side surface of the wiring board. The shield film is electrically connected to a ground conductor. The conductive member is formed by firing simultaneously with the wiring board, and electrically connected to the ground conductor and electrically connected to the shield film.
Claims22
A module comprising:
- a wiring board having a first main surface, the wiring board being a ceramic board including a ground conductor;
- a first component and a second component, the first component and the second component being mounted on the first main surface;
- at least one conductive member disposed on the first main surface in direct contact therewith, wherein the conductive member is disposed between the first component and the second component;
- a sealing resin sealing the first component, the second component, and the conductive member;
- and
- a shield film covering an upper surface and a side surface of the sealing resin and a side surface of the wiring board, wherein
- the shield film is electrically connected to the ground conductor,
- the conductive member is a sintered body formed by sintering a conductive paste, and
- the conductive member is a simultaneously fired member with the wiring board, and is electrically connected to the ground conductor and electrically connected to the shield film.
A method of manufacturing a module, the method comprising:
- stacking a plurality of ceramic green sheets to obtain a first multilayer body;
- preparing a conductive member forming sheet made of a material not substantially sintering at a temperature at which the ceramic green sheets sinter;
- providing a through hole in the conductive member forming sheet;
- filling the through hole with a conductive paste capable of sintering at the temperature at which the ceramic green sheets sinter;
- stacking the conductive member forming sheet on one main surface of the first multilayer body to obtain a second multilayer body, the conductive member forming sheet having the through hole filled with the conductive paste;
- firing the second multilayer body at the temperature at which the ceramic green sheets sinter and the conductive paste is capable of sintering, wherein a conductive member is formed as a member obtained by sintering of the conductive paste;
- after the firing the second multilayer body, removing a portion of the conductive member forming sheet, the portion excluding the conductive member;
- mounting a component on the one main surface of the first multilayer body;
- disposing a sealing resin to cover the component and the conductive member;
- providing an opening in the sealing resin such that the conductive member is exposed;
- and
- after the providing an opening, forming a shield film to electrically connect to the conductive member in a state where the shield film covers an outer surface of the sealing resin and an inner surface of the opening.
Dependencies are inferred from the claim text.