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US 11,889,622 B2Granted
Electronic device with connected component carrier and fluid cooling member
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorGerald Weis
Life of this patent
Estimating the term…
Abstract
An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure.
Claims20
An electronic device, comprising:
- a component carrier comprising a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- an electronic component on and/or in the stack;
- and
- a cooling member with a fluid cooling unit at least partially therein;
- wherein the component carrier and the cooling member are connected by a connection structure,
- wherein the cooling member comprises a further component carrier which comprises a further stack comprising at least one further electrically conductive layer structure and/or at least one further electrically insulating layer structure.
3 more elements
A method of manufacturing an electronic device, the method comprising:
- mounting an electronic component on and/or in a stack of a component carrier, the stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- forming at least part of a fluid cooling unit in a cooling member;
- and
- connecting the component carrier and the cooling member by a connection structure,
- wherein the cooling member comprises a further component carrier which comprises a further stack comprising at least one further electrically conductive layer structure and/or at least one further electrically insulating layer structure.
2 more elements
An electronic device, comprising:
- a component carrier comprising a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- an electronic component on and/or in the stack;
- and
- a cooling member with a fluid cooling unit at least partially therein;
- wherein the component carrier and the cooling member are connected by a connection structure,
- wherein the fluid cooling unit is formed in the cooling member and closed by the component carrier.
3 more elements
Dependencies are inferred from the claim text.