Wiring board, electronic component package, and electronic apparatus
AssigneeKYOCERA Corporation
InventorToshihiko Kitamura
Life of this patent
Estimating the term…
Abstract
A dielectric substrate has a first surface including a first terminal joint and a second terminal joint arranged along a first side surface. A first lead terminal is bonded to the first terminal joint with a bond. A second lead terminal is bonded to the second terminal joint with a bond. The first lead terminal includes a first base bonded to the first terminal joint and a first lead extending from the first base. The second lead terminal includes a second base bonded to the second terminal joint and a second lead extending from the second base. The first lead terminal includes the first base having a larger thickness than the first lead.
Claims17
A wiring board, comprising:
- a dielectric substrate;
- a first lead terminal;
- and
- a second lead terminal,
- wherein the dielectric substrate has a first surface, a second surface opposite to the first surface, and a first side surface continuous with the first surface and the second surface,
- the first surface includes a first terminal joint and a second terminal joint arranged along the first side surface,
- the first lead terminal includes a first base bonded to the first terminal joint and a first lead extending from the first base,
- the second lead terminal includes a second base bonded to the second terminal joint and a second lead extending from the second base,
- the second lead includes a bent portion that extends away from the dielectric substrate and is continuous with the second base, and a straight portion that is continuous with the bent portion and extends parallel to the second base, and
- the first base has a larger thickness than the first lead.
A wiring board, comprising:
- a dielectric substrate;
- a first lead terminal;
- and
- a second lead terminal,
- wherein the dielectric substrate has a first surface, a second surface opposite to the first surface, and a first side surface continuous with the first surface and the second surface,
- the first surface includes a first terminal joint and a second terminal joint arranged along the first side surface,
- the first lead terminal includes a first base bonded to the first terminal joint and a first lead extending from the first base,
- the second lead terminal includes a second base bonded to the second terminal joint and a second lead extending from the second base,
- the first terminal joint includes a step defined in a portion of the first side surface and recessed toward the second surface, and
- the first base overlaps the step as viewed from above.
A wiring board, comprising:
- a dielectric substrate;
- a first lead terminal;
- and
- a second lead terminal,
- wherein the dielectric substrate has a first surface, a second surface opposite to the first surface, and a first side surface continuous with the first surface and the second surface,
- the first surface includes a first terminal joint and a second terminal joint arranged along the first side surface,
- the first lead terminal includes a first base bonded to the first terminal joint, a first lead extending from the first base, and a joint between the first base and the first lead,
- the second lead terminal includes a second base bonded to the second terminal joint and a second lead extending from the second base, and
- the first lead terminal further includes a joint between the first base and the first lead, and
- the joint has an inclined surface or a curved surface continuous with a surface of the first base and a surface of the first lead.
Dependencies are inferred from the claim text.