Techniques for high-speed signal layer transition

A method of routing a conductive path within a printed circuit board (PCB) having a first surface and a second surface that is opposite the first surface, the method comprising:

• routing a first segment of a conductive path from a first layer of a plurality of layers of the PCB to a second layer of the plurality of layers of the PCB utilizing a first via, wherein the first via extends from the first layer to the second surface of the PCB and comprises a first portion that is on the conductive path between the first layer and the second layer and a second portion that is not on the conductive path between the first layer and the second layer, and wherein a length of the first portion of the first via is greater than a length of the second portion of the first via;
• routing a second segment of the conductive path from the first layer to the second layer utilizing a second via, wherein the second via extends from the second surface of the PCB to the second layer and comprises a first portion that is on the conductive path between the first layer and the second layer and a second portion that is not on the conductive path between the first layer and the second layer, and wherein a length of the first portion of the second via is greater than a length of the second portion of the second via;
• and
• routing a third segment of the conductive path between the first via and the second via.

A printed circuit board (PCB) comprising:

• a plurality of layers, wherein the plurality of layers are between a first surface of the PCB and a second surface of the PCB that is opposite the first surface;
• and
• a conductive path comprising a first segment, a second segment, and a third segment,
• wherein the first segment of the conductive path comprises a first via that extends from a first layer of the plurality of layers to the second surface,
• wherein a length of a first portion of the first via between the first layer and the second surface is greater than a distance between the first layer and the first surface,
• wherein the second segment of the conductive path comprises a second via from the second surface of the PCB to a second layer of the plurality of layers of the PCB,
• wherein a length of a first portion of the second via between the second layer and the second surface is greater than a distance between the second layer and the first surface, and
• wherein the third segment of the conductive path is electrically coupled between the first via and the second via.