Electrical connecting portion for a device with a heating function

An electrical connecting portion for a device with a heating function, comprising:

• a substrate made of a light-transmittable material and including a front face and a rear face;
• at least one electrically conductive coating layer disposed on the front face of the substrate;
• and
• at least one copper layer disposed on the electrically conductive coating layer, wherein the copper layer includes at least one first through-hole extending in a front-rear direction corresponding to the substrate;
• wherein the electrically conductive coating layer substantially covers the copper layer and fills the first through-hole of the copper layer.

An electrical connecting portion for a device with a heating function, comprising:

• a substrate made of a light-transmittable material and including a front face and a rear face;
• two substantially parallel electrically conductive coating layers respectively disposed on the front face of the substrate;
• and
• two substantially parallel copper layers respectively disposed on the front face of the two substantially parallel electrically conductive coating layer, wherein each of the two substantially parallel copper layers is disposed on a front face of a respective one of the two substantially parallel electrically conductive coating layers;
• wherein each of the two substantially parallel electrically conductive coating layers and the substrate have aligned through-holes extending in a front-rear direction corresponding to the substrate, and wherein a fastener extends through the aligned through-holes;
• and
• wherein the two substantially parallel copper layers are arranged insulated relative to each other, wherein each of the two substantially parallel copper layers has at least one aligned-hole which is aligned with the aligned through-holes of the respective one of the two substantially parallel electrically conductive coating layers and the substrate, and wherein the fastener extends through the at least one aligned through-hole of a respective one of the two substantially parallel copper layers.