PUF-film and method for producing the same
AssigneeFraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
InventorMartin Koenig
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Abstract
A method for producing a PUF-film includes printing a layer of dielectric material on a film substrate, such that a variable thickness of the layer is obtained by the printing. The method includes arranging a structured electrode layer on the dielectric material such that the structured electrode layer is influenced with respect to an electric measurement value due to the variable thickness.
Claims14
A physically uncloneable function, PUF, film comprising a layer stack, the layer stack comprising:
- a film substrate, a printed dielectric layer comprising a varying layer thickness in the dielectric layer and a structured electrode layer being arranged at the dielectric layer, wherein the structured electrode layer is influenced with respect to an electric measurement value due to the variable thickness;
- wherein the structured electrode layer is a first structured electrode layer, wherein between the film substrate and the dielectric layer at least a part of a second structured electrode layer is arranged, wherein the dielectric layer is printed onto the second structured electrode layer such that the dielectric layer covers the second structured electrode layer in a first region and does not cover the second structured electrode layer in a second region, wherein a material edge of the dielectric layer extends between the first region and the second region, wherein the first structured electrode layer is arranged in the first region and in the second region such that the first structured electrode layer extends over the material edge and is spaced from the second structured electrode layer in the first region by the dielectric layer and is galvanically connected to the second structured electrode layer or arranged in a common plane with the second structured electrode layer in the second region;
- wherein the first structured electrode layer and the second structured electrode layer are arranged such that the first structured electrode layer and the second structured electrode layer are connectable in a common connector layer.
A physically uncloneable function, PUF, film comprising a layer stack, the layer stack comprising:
- a film substrate, a printed dielectric layer comprising a varying layer thickness in the dielectric layer and a structured electrode layer being arranged at the dielectric layer, wherein the structured electrode layer is influenced with respect to an electric measurement value due to the variable thickness;
- wherein the structured electrode layer is a first structured electrode layer, wherein the film substrate comprises a second structured electrode layer comprising a plurality of second conductive traces, wherein the a dielectric material of the dielectric material is printed onto the second structured electrode layer, wherein the first structured electrode layer is arranged such that the first structured electrode layer comprises a plurality of first conductive traces overlapping with the second conductive traces in a plurality of overlapping regions so as to form capacitive elements in the overlapping regions;
- and
- wherein the first structured electrode layer is arranged such that at least one of the first conductive traces overlaps with at least two second conductive traces;
- or such that at least one of the second conductive traces overlaps with at least two first conductive traces.
Dependencies are inferred from the claim text.