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US 11,888,462 B2Granted
Bonded body and acoustic wave element
AssigneeNGK Insulators, Ltd.
InventorsYudai Uno, Masashi Goto, Tomoyoshi Tai
Life of this patent
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Abstract
A bonded body includes a supporting substrate; a piezoelectric material substrate; a first bonding layer provided on the supporting substrate and having a composition of Si(1-x)Ox (0.008≤x≤0.408); a second bonding layer provided on the piezoelectric material substrate and having a composition of Si(1-y)Oy (0.008≤y≤0.408); and an amorphous layer provided between the first bonding layer and second bonding layer. The oxygen ratio of the amorphous layer is higher than the oxygen ratio of the first bonding layer and oxygen ratio of the second bonding layer.
Claims9
A bonded body comprising:
- a supporting substrate;
- a piezoelectric material substrate;
- a first bonding layer provided on said supporting substrate and having a composition of Si(1-x)Ox (0.008≤x≤0.408);
- a second bonding layer provided on said piezoelectric material substrate and having a composition of Si(1-y)Oy (0.008≤y≤0.408);
- and
- an amorphous layer provided between said first bonding layer and said second bonding layer,
- wherein an oxygen ratio of said amorphous layer is higher than an oxygen ratio of said first bonding layer and an oxygen ratio of said second bonding layer.
4 more elements
Dependencies are inferred from the claim text.