Laser chip for flip-chip bonding on silicon photonics chips

A laser chip for flip-chip bonding to a silicon photonics chip comprising a waveguide, the laser chip comprising:

• an active region disposed in the laser chip along a plane parallel to the waveguide in the silicon photonics chip;
• a first pair of stoppers formed on the laser chip to mate with a second pair of stoppers formed on the silicon photonics chip when the laser chip is bonded to a bonding site on the silicon photonics chip, the first and second pairs of stoppers extending along an axis perpendicular to the plane, at least one of the first pair of stoppers and the second pair of stoppers being configured to align the active region away from the waveguide towards the bonding site on the silicon photonics chip;
• and
• a metal film with an edge shared with an end of the active region facing the waveguide, the metal film indicating a position of the active region to align the active region relative to the waveguide along the plane parallel to the waveguide.

A laser chip for flip-chip bonding to a silicon photonics chip comprising a waveguide, the laser chip comprising:

• an active region disposed in the laser chip along a plane parallel to the waveguide in the silicon photonics chip;
• a first pair of stoppers formed on the laser chip to mate with a second pair of stoppers formed on the silicon photonics chip when the laser chip is bonded to a bonding site on the silicon photonics chip, the first and second pairs of stoppers extending along an axis perpendicular to the plane, at least one of the first pair of stoppers and the second pair of stoppers being configured to align the active region away from the waveguide towards the bonding site on the silicon photonics chip;
• a first pair of alignment marks disposed symmetrically on either side of the active region, the first pair of alignment marks being configured to align with a second pair of alignment marks on the bonding site on the silicon photonics chip to align the active region relative to the waveguide along the plane parallel to the waveguide;
• and
• a metal film with an edge shared with an end of the active region facing the waveguide, the metal film indicating a position of the active region to align the active region relative to the waveguide along the plane parallel to the waveguide.

A laser chip for flip-chip bonding to a silicon photonics chip comprising a waveguide, the laser chip comprising:

• an active region disposed in the laser chip along a plane parallel to the waveguide in the silicon photonics chip;
• and
• a first pair of stoppers formed on the laser chip to mate with a second pair of stoppers formed on the silicon photonics chip when the laser chip is bonded to a bonding site on the silicon photonics chip, the first and second pairs of stoppers extending along an axis perpendicular to the plane, at least one of the first pair of stoppers and the second pair of stoppers being configured to align the active region away from the waveguide towards the bonding site on the silicon photonics chip;
• and
• wherein the active region extends between a front facet and a rear facet that are disposed along the plane parallel to the waveguide with the front facet facing the waveguide, the active region being disposed between an n-type doped region and a p-type doped region with the p-type doped region being narrower than the n-type doped region and being bonded to the bonding site on the silicon photonics chip, and the first pair of stoppers extending from the n-type doped region parallel to the p-type doped region.