Method for manufacturing light-emitting device

A light-emitting device comprising:

• a package comprising:
• a light-emitting element comprising a first surface and a second surface opposite to the first surface;
• a first light-transmissive member arranged on the second surface of the light-emitting element;
• paired electrodes at the first surface of the light-emitting element;
• and
• a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member;
• a light-guiding plate on which the package is placed;
• a second covering member arranged on the light-guiding plate and covering laterally the package;
• paired wirings continuously covering the paired electrodes exposed and the first covering member and being connected to the paired electrodes respectively, the paired wirings comprising a mixture of a resin and metal powder;
• and
• a third light-transmissive member bonding the package or the light-emitting element to the light-guiding plate,
• wherein a part of the first covering layer arranged between the paired electrodes is removed,
• wherein the light-guiding plate has a first recess or a through-hole,
• wherein the package or the light-emitting element is arranged in the first recess or the through-hole, and
• wherein a third light-transmissive member is arranged in the first recess or the through-hole.

A light-emitting device comprising:

• a package comprising:
• a light-emitting element comprising a first surface and a second surface opposite to the first surface;
• a first light-transmissive member arranged on the second surface of the light-emitting element;
• paired electrodes at the first surface of the light-emitting element;
• and
• a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member;
• a light-guiding plate on which the package is placed;
• a second covering member arranged on the light-guiding plate and covering laterally the package;
• and
• paired wirings continuously covering the paired electrodes exposed and the first covering member and being connected to the paired electrodes respectively, the paired wirings comprising a mixture of a resin and metal powder,
• wherein a part of the first covering layer arranged between the paired electrodes is removed, and
• wherein at least one groove between the paired electrodes has a width of 10 μm to 100 μm and a depth of 0.1 μm to 3 μm.