Light emitting diodes manufacture and assembly

A method, comprising:

• forming an epitaxial layer on a starter substrate attaching the epitaxial layer onto a first carrier substrate;
• etching away the starter substrate;
• attaching the epitaxial layer onto a second carrier substrate;
• moving the first carrier substrate away from the epitaxial layer;
• etching away part of the epitaxial layer to form a plurality of light emitting diode (LED) dies on the epitaxial layer;
• forming device-side bumps the plurality of LED dies;
• forming backplane-side bumps on at least one of one or more pre-determined locations on a backplane, the at least one of one or more pre-determined locations corresponding to the one or more selected LED dies of the plurality of LED dies;
• establishing one or more conductive bonds between the device-side bumps on the one or more selected LED dies and the corresponding backplane-side bumps on the backplane;
• and
• moving the second carrier substrate away from the backplane to transfer the one or more LED dies to the backplane.