Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip
AssigneeOSRAM Opto Semiconductors GmbH
InventorsWerner Bergbauer, Thomas Lehnhardt, Jürgen Off, Joachim Hertkorn
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AssigneeOSRAM Opto Semiconductors GmbH
InventorsWerner Bergbauer, Thomas Lehnhardt, Jürgen Off, Joachim Hertkorn
Estimating the term…
In an embodiment an electronic semiconductor chip includes a growth substrate with a growth surface including a flat region having a plurality of three-dimensionally designed surface structures on the flat region, a nucleation layer composed of oxygen-containing AlN in direct contact with the growth surface at the flat region and the three-dimensionally designed surface structures and a nitride-based semiconductor layer sequence on the nucleation layer, wherein the semiconductor layer sequence overlays the three-dimensionally designed surface structures, and wherein the oxygen content in the nucleation layer is greater than 1019 cm−3.
An electronic semiconductor chip comprising:
A method for producing an electronic semiconductor chip, the method comprising:
Dependencies are inferred from the claim text.