Semiconductor device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsMei-Yi Wu, Chang Chin Tsai, Bo-Yu Huang, Ying-Chung Chen
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Abstract
The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.
Claims14
A semiconductor device package, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- an optical device disposed on the first surface of the substrate;
- and
- an electronic device disposed on the second surface of the substrate, wherein a power of the electronic device is greater than a power of the optical device;
- a case disposed on the second surface of the substrate and defining a space for accommodating the electronic device;
- and
- a first thermal paste connecting the case and the electronic device;
- wherein a vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero;
- wherein the vertical projection of the optical device on the first surface overlaps with a vertical projection of the case on the second surface of the substrate.
A semiconductor device package, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- a first component disposed on the first surface of the substrate, the first component having a first power;
- a second component disposed on the second surface of the substrate, the second component having a second power;
- a third component disposed on the first surface of the substrate or the second surface of the substrate, the third component having a third power, wherein either the first power or the second power is greater than the third power;
- a case disposed on the second surface of the substrate and covering the second component, wherein the case comprises an opening;
- and
- a thermal paste disposed in the opening of the case;
- wherein the first component is spaced apart from the second component along a direction perpendicular to a normal direction of the first surface.
A semiconductor device package, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- a first component disposed on the first surface of the substrate, the first component having a first power;
- a second component disposed on the second surface of the substrate, the second component having a second power;
- a third component disposed on the first surface of the substrate or the second surface of the substrate, the third component having a third power, wherein either the first power or the second power is greater than the third power;
- a through via connecting the first surface and the second surface of the substrate, wherein the through via is in contact with the first component;
- and
- a heat conductor disposed on the second surface of the substrate and in contact with the through via;
- wherein the first component is spaced apart from the second component along a direction perpendicular to a normal direction of the first surface.
Dependencies are inferred from the claim text.