Semiconductor device and method for manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsToshiki Hikosaka, Hiroshi Ono, Jumpei Tajima, Masahiko Kuraguchi, Shinya Nunoue
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AssigneeKabushiki Kaisha Toshiba
InventorsToshiki Hikosaka, Hiroshi Ono, Jumpei Tajima, Masahiko Kuraguchi, Shinya Nunoue
Estimating the term…
According to one embodiment, a semiconductor device includes a first electrode, a second electrode, a third electrode, a first semiconductor layer, a second semiconductor layer, and a first insulating layer. A position of the third electrode in a first direction is between a position of the first electrode in the first direction and a position of the second electrode in the first direction. The first semiconductor layer includes Alx1Ga1-x1N and includes a first partial region, a second partial region, and a third partial region. The second semiconductor layer includes Alx2Ga1-x2N. A portion of the second semiconductor layer is between the third partial region and the third electrode in the second direction. The first insulating layer includes a first insulating region. The first insulating region is between the third electrode and the portion of the second semiconductor layer in the second direction.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.