Transistors with metal chalcogenide channel materials
AssigneeIntel Corporation
InventorsAbhishek A. Sharma, Ashish Agarwal, Urusa Alaan, Christopher Jezewski, Kevin Lin, Carl Naylor
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AssigneeIntel Corporation
InventorsAbhishek A. Sharma, Ashish Agarwal, Urusa Alaan, Christopher Jezewski, Kevin Lin, Carl Naylor
Estimating the term…
Transistor structures employing metal chalcogenide channel materials may be formed where a chalcogen is introduced into at least a portion of a precursor material that comprises reactive metal(s). The precursor material may be substantially metallic, or may be a metallic oxide (e.g., an oxide semiconductor). The metal(s) may be transition, Group II, Group III, Group V elements, or alloys thereof. An oxide of one or more such metals (e.g., IGZO) may be converted into a chalcogenide (e.g., IGZSx or IGZSex) having semiconducting properties. The chalcogenide formed in this manner may be only a few monolayers in thickness (and may be more thermally stable than many oxide semiconductors. Where not all of the precursor material is converted, a transistor structure may retain the precursor material, for example as part of a transistor channel or a gate dielectric. Backend transistors including metal chalcogenide channel materials may be fabricated over silicon CMOS circuitry.
A transistor structure, comprising:
Dependencies are inferred from the claim text.