Method of producing a silicon carbide device with a trench gate

A method of producing a silicon carbide device, the method comprising:

• forming a stripe-shaped trench gate structure that extends from a first surface of a silicon carbide body into the silicon carbide body, the gate structure having a gate length along a lateral first direction, wherein a bottom surface and a first gate sidewall of the gate structure are connected via a first bottom edge of the gate structure;
• forming at least one source region of a first conductivity type;
• and
• forming a shielding region of a second conductivity type in contact with the first bottom edge of the gate structure across at least 20% of the gate length,
• wherein forming the shielding region comprises:
• forming a deep shielding portion;
• and
• forming a top shielding portion between the first surface and the deep shielding portion, the top shielding portion being in contact with the first bottom edge,
• wherein forming the shielding region comprises implanting the deep shielding portion and the top shielding portion such that the top shielding portion and the deep shielding portion overlap with each other and one or more end-of-range implant peaks that define the deep shielding portion are located within the top shielding portion.

A method of producing a silicon carbide device, the method comprising:

• forming a stripe-shaped trench gate structure that extends from a first surface of a silicon carbide body into the silicon carbide body, the gate structure having a gate length along a lateral first direction, wherein a bottom surface and a first gate sidewall of the gate structure are connected via a first bottom edge of the gate structure;
• forming at least one source region of a first conductivity type;
• and
• forming a shielding region of a second conductivity type in contact with the first bottom edge of the gate structure across at least 20% of the gate length,
• wherein forming the shielding region comprises:
• forming a deep shielding portion;
• and
• forming a top shielding portion between the first surface and the deep shielding portion, the top shielding portion being in contact with the first bottom edge,
• wherein the at least one source region and the top shielding portion are formed by implanting using different implant masks,
• wherein along the lateral first direction, openings in the implant mask used for implanting the at least one source region are narrower than a length of mask columns of the implant mask used for implanting the top shielding portion.