Partial discharge suppression in high voltage solid-state devices
AssigneesLawrence Livermore National Security, LLC, Opcondys, Inc.
InventorsStephen Sampayan, Kristin Cortella Sampayan
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Abstract
Devices, methods and techniques are disclosed to suppress electrical discharge and breakdown in insulating or encapsulation material(s) applied to solid-state devices. In one example aspect, a multi-layer encapsulation film includes a first layer of a first dielectric material and a second layer of a second dielectric material. An interface between the first layer and the second layer is configured to include molecular bonds to prevent charge carriers from crossing between the first layer and the second layer. The multi-layer encapsulation configuration is structured to allow an electrical contact and a substrate of the solid-state device to be at least partially surrounded by the multi-layer encapsulation configuration.
Claims20
An electronic device, comprising:
- a substrate;
- a first electrical contact positioned on the substrate;
- and
- a multi-layer encapsulation film surrounding at least a top surface of the first electrical contact and at least part of the substrate, wherein the multi-layer encapsulation film comprises multiple layers of one or more dielectric materials, wherein an interface between two adjacent layers of the multiple layers is configured to include molecular bonds to prevent charge carriers from crossing between the two adjacent layers.
A multi-layer encapsulation configuration for use in an electronic device, comprising:
- a first layer of a first dielectric material, and
- a second layer of a second dielectric material, wherein an interface between the first layer and the second layer is configured to include molecular bonds to prevent charge carriers from crossing between the first layer and the second layer, and wherein the multi-layer encapsulation configuration is structured to allow at least a top surface of an electrical contact and at least part of a substrate of the electronic device to be surrounded by the multi-layer encapsulation configuration.
A method for providing a multi-layer encapsulation configuration for use in an electronic device, comprising:
- depositing a first layer of a first dielectric material on an electrical contact of the electronic device, wherein the electrical contact is positioned on a substrate of the electronic device, and wherein the first layer surrounds at least a top surface of the electrical contact and at least part of the substrate;
- curing at least partially the first layer of the first dielectric material;
- and
- depositing a second layer of a second dielectric material on the first layer of the first dielectric material, wherein molecular bonds formed at an interface between the first layer and the second layer are configured to prevent charge carriers from crossing between the first layer and the second layer.
Dependencies are inferred from the claim text.