Thin film transistor structures with regrown source and drain

An integrated circuit (IC) structure, comprising:

• a plurality of complementary metal-oxide-semiconductor (CMOS) field effect transistor (FET) structures, wherein individual ones of the CMOS FET structures comprise a crystalline Group IV material;
• and
• a plurality of CMOS thin film transistor (TFT) structures, the CMOS TFT structures comprising:
• an NMOS TFT, comprising:
• an n-type source material separated from an n-type drain material by a first length of channel material, wherein the channel material has a first composition, and the source and the drain materials have a second composition, different than the first composition;
• a first gate electrode separated from the channel, n-type source material, and n-type drain material by one or more gate dielectric materials, wherein the first gate electrode has a second length, in a direction parallel to the first length, that is larger than the first length;
• a source contact metallization coupled to the n-type source material;
• and
• a drain contact metallization coupled to the n-type drain material;
• and
• a PMOS TFT, comprising:
• a p-type source material separated from a p-type drain material by a third length of channel material having the first composition, wherein the p-type source and drain materials have a third composition, different than the first and second compositions, wherein a majority constituent of the p-type source material is Sn;
• a second gate electrode separated from the channel material, p-type source material, and p-type drain material by the one or more gate dielectric materials, wherein the second gate electrode has a fourth length, in the direction parallel to the third length, that is larger than the third length;
• a source contact metallization coupled to the p-type source material;
• and
• a drain contact metallization coupled to the p-type drain material.