Method of operating microelectronic package

A method of operating a microelectronic package, comprising a processing device stacking vertically with at least one memory device, the method comprising steps of:

• reading data stored in a plurality of memory cells of a plurality of memory units of the memory device, with the processing device, with a plurality of signal channels each of which is dedicated to transmit signals from the processing device to one of the memory units and vice versa;
• performing a test, with the processing device, on the memory cells in the memory units of the at least one memory device;
• and
• indicating a failure found with the test, with the processing device.